उत्पाद विशेषता |
|
|
|
|
भाग संख्या |
XCZU7EV-1FBVB900E |
XCZU7EV-1FBVB900I |
XCZU7EV-2FBVB900I |
XCZU7EV-2FFVC1156I |
उत्पादक |
AMD |
AMD |
AMD |
AMD |
पैकेज / प्रकरण |
900-BBGA, FCBGA |
900-BBGA, FCBGA |
900-BBGA, FCBGA |
1156-BBGA, FCBGA |
फ्लैश आकार |
- |
- |
- |
- |
कोर प्रोसेसर |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
कनेक्टिविटी |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
परिचालन तापमान |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
रैम आकार |
256KB |
256KB |
256KB |
256KB |
आर्किटेक्चर |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
I / O की संख्या |
204 |
204 |
204 |
360 |
शृंखला |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EV |
Zynq® UltraScale+™ MPSoC EV |
बाह्य उपकरणों |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |
प्राथमिक गुण |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
आधार उत्पाद संख्या |
XCZU7 |
XCZU7 |
XCZU7 |
XCZU7 |
गति |
500MHz, 600MHz, 1.2GHz |
500MHz, 600MHz, 1.2GHz |
533MHz, 600MHz, 1.3GHz |
533MHz, 600MHz, 1.3GHz |
प्रदायक डिवाइस पैकेज |
900-FCBGA (31x31) |
900-FCBGA (31x31) |
900-FCBGA (31x31) |
1156-FCBGA (35x35) |
पैकेट |
Tray |
Tray |
Tray |
Tray |